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Home >
Material >
CVD Diamond >
Heat Spreaders > Introduction |
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Heat Spreaders |
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CVD Diamond
for
Thermal management
applications
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AWIN
Diamond offers the wide range of
Diamond heat spreaders, manufactured
by
Element
Six.
Element
Six
is the world's
leading developer and producer of
technical solutions with diamond.
Diamond products from
Element
Six
use the unique properties of both
synthetic and natural diamond. Our
solutions exceed our customers'
expectations in optical, thermal,
cutting and electronic applications.
Element
Six
is continually
discovering applications and areas
where diamond fulfils customers'
requirements far better than any
other material. Diamond, with its
unique combination of properties is
an excellent material for various
thermal management applications.
Element
Six
announces the
availability of a range of Diafilm
TM grades of Chemical Vapour
Deposition (CVD) diamond, suitable
for thermal management applications
where diamond’s exceptional thermal
diffusivity and conductivity is
required. |
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All products in the Diafilm TM
series (TM 100, TM 150, TM 180) have
engineered properties which make
them the material of choice in many
thermal management applications. The
success of Diafilm TM is based on
its superior heat spreading
capabilities. As well as dissipating
heat, CVD diamond can be prepared
with high precision edges and can be
metallised. Typical application
areas include submounts for laser
diodes for the telecommunications
industry, high power discrete
diodes, laser diode arrays, high
power RF transistors and high power
VCSELs. |
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Property |
Diafilm
TM 100 |
Diafilm
TM 150 |
Diafilm
TM 180 |
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Thermal
conductivity
@300K (W/mK)
@425K (W/mK) |
> 1000
> 900 |
> 1500
> 1400 |
> 1800
> 1500 |
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Thermal
expansion
coefficient
@300K (ppm/K)
@10000K (ppm/K) |
1.0
± 0.1
4.4 ± 0.1 |
1.0
± 0.1
4.4 ± 0.1 |
1.0
± 0.1
4.4 ± 0.1 |
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Thermal
diffusivity
@300K (cm2/s) |
> 5.5 |
> 8.3 |
> 10.0 |
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Specific
heat
capacity
@300K (J/kgK) |
520 |
520 |
520 |
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Vickers
hardeness
@300K (kg/mm2) |
8000 - 1900 |
8000 - 1900 |
8000 - 1900 |
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Fracture
toughness
(MPam0.5) |
5.3 - 7.0 |
5.3 - 7.0 |
5.3 - 7.0 |
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Young's
modulus (GPa) |
1000 - 1100 |
1000 - 1100 |
1000 - 1100 |
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Poisson's
ratio |
0.1 |
0.1 |
0.1 |
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Density
(103
kg/m3) |
3.52 |
3.52 3.52 |
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Supply of CVD
Diamond (CVDD) Heat
Spreaders
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Tc >1000, > 1500
and >1800 W/mK,
Standard
thickness
0.25mm, 0.30mm
and 0.40
mm, thickness
tolerance
±
25μm
standard,
± 10μm
upon request.
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Supply of
assembled (AlN -
CVDD) parts
using high
quality soler
joints (AuGe or
AuSn) or thermal
compression
bonding.
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High edge
quality,
chip-outs; <25μm
standard, <10μm
on demand,
metallisation of
critical area
to-the-edge.
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Surface finish:
highly polished
surfaces
available (Ra <
50 nm).
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Full face
Ti/Pt/Au sputter
deposited metal
layers.
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Full face
eutectic AuSn
(Tm = 279°C)
solder layers.
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Ti/Pt/Au sputter
deposited metal
patterns.
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Wrap around
coatings.
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Solder pads with
eutectic AuSn
(Tm = 279°C).
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Very tight
flatness
specification
available upon
request.
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In this section
Thermal Material
Properties
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