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Home >
Product >
Heat Spreaders > CVD Diamond High Power Resistor |
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CVD Diamond High Power
Resistors |
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Giving your PAs of
RF with extreme high
power at higher
frequecncy, and low
capacitance
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CVD diamond high
power resistors are
the thin film
passive components
using CVD diamond as
the resistor
substrate. These
resistors can
provide extremely
high power rating
possibilities on
smallest area and
lower parasitic
behavior (i.e.,
lower pF/W, better
isolation), which is
ideal for
applications such as
up to 30 GHz in 5G
communications and
military
millimeter-wave (MMW)
devices, phased
array radar, high
power Wilkinson
power
dividers/combiners,
dual junctions
circulator duplexers
and feedback
networks for power
amplifiers (PAs) in
RF. All thin film
products are made
with pure Au
contacts, suitable
for soldering and
wire bonding.
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Typical product
specifications
Substrate material : CVD Diamond
Substrate thermal
conductivity : TC >
1000 W/mK
Substrate relative
dielectric constant
:er
»
5.5
Resistor material :
TaN
Resistance : 50Ω±5%
or trimmed to
specification, other
values on request
Contact material :
Ti / Pt/ Au
Backside coating :
Ti / Pt/ Au
Standard
Designs |
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Type
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DRCVD20
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RCVD50
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RCVD80
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RCVD125 |
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#150-112-
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1020-B
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1019-B
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1018-B
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1017-B |
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Lenght1 (mm)
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1.14
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1.40
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1.65
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2.67 |
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Width1 (mm) |
0.63
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1.40
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0.89
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2.67 |
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Thickness1 (mm) |
0.38
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0.38
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0.38
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0.38 |
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Power CW (W) |
20
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50
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80
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125 |
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Capacitance2 (pF)
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0.09 |
0.25
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0.19
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0.91 |
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Thermal resistance 2(K/W)
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0.53
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0.19
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0.26
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0.05 |
1 dimensional accuracy
士0.127 mm
2
calculated DC
capacitance and CW
thermal resistance
Metallization
setback from edge :
minimally 0.06mm,
Metallization
thickness : 士25% for
each layer
Au-contact width
0.23mm (0.38mm for
RCVD125)
Au metallization
suitable for wire
bonding and most
solder processes
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Specifications
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1 Electrical |
Resistance |
50
W±5% or
trimmed to
specification |
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Capacitance |
0.09-0.91 pF
(see table) |
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Input power
CW |
20-125 Watt
(see table) |
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Peak power |
not tested |
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2 Thermal |
Thermal
Resistance |
0.05-0.53
K/W (see
table) |
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Operating
temperature |
lower bound
not tested,
tested up to
125
°C |
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Maximum |
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Storage
temperature |
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Temperature
Coefficient
of
Resistance |
-1000 ppm/K |
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Temperature
Coefficient |
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3 Marking |
optional |
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4 Quality |
Visual and
mechanical
inspection
per 824W154 |
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5 Packaging |
Waffle pack |
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