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首頁 > 材料 >
天然鑽石 >
晶片切割刀 > Introduction |
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Scriber |
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Scribe dicing is a
controlled cleaving
process that cleanly
singularizes the
dice in a
semiconductor wafer
without removing
material. A diamond
tool creates a
scriber line in thee
separation grids
between the dice.
This line is the
origin of controlled
fracture during the
breaking process.
The scribe line is
3-4µm wide, but
under the scribe
line is a fracture
that penetrates the
wafer to a depth of
25µm or greater. A
slight bending,
normally 1-2 degree,
will cause the
scribe to break
cleanly through the
wafer along natural
crystal planes.
Advantage:
■
Scribe
dicing is
clean, safe,
reliable and
economical.
■ With
a narrow
scribe line
and
controlled
fracture,
die street
widths can
be narrowed
to
30µm(150mm
wafers) and
20µm (50mm
wafers).
■
There is no
loss from
contamination
and
degradation
in die
performance.
Ideal materials
for diamond
scribe dicing
|
Material |
Applicable
wafer
diamonds |
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GaAs &
InP |
Wafer
thickness
of
0.05-0.7mm
with die
dimensions
from 0.2
to over
15mm and
diameters
up to
200mm >
99%
yield. |
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Si & Ge |
Wafer
thickness
of
0.05-0.3mm,
die
dimensions
and
yield as
above. |
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Glass |
Wafer
thickness
of
0.05-0.5mm,
die
dimensions
from
0.25 to
over
15mm and
200mm
substrates.
The
Awindiamond
tool
gives
high
throughput
and 99%
yield. |
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Sapphire
(R-plane) |
Used for
silicon-on
sapphire
high-frequency
circuits.
Scribes
and
breaks
easily
without
debris
damage
to the
circuitry.
Street
width
can be
reduces
from 250
to 35µm
with a
resultant
82%
increase
in die
per
wafer. |
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In this section
3P
Diamond
Scriber
4P
Diamond
Scriber
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